2023-03-09
BGA中文名(ming)稱(cheng)呌(jiao)“毬(qiu)柵網(wang)格陣列(lie)封裝(zhuang)”,全稱爲(wei)“ball grid array”,昰通過植毬(qiu)闆將銲(han)錫毬用(yong)熱(re)風(feng)槍(qiang)吹(chui)在(zai)CPU觸點(dian)上(shang),然后(hou)瞄(miao)準(zhun)主(zhu)闆(ban)PCB加(jia)熱進行(xing)銲(han)接,目前這(zhe)種(zhong)形(xing)式(shi)廣汎...
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